100G SR4 optical module have the advantages of high transmission rate, mature technology, and low cost, and have been widely used in data centers and data communication access networks. The 100G SR4 optical module adopts the industry’s mainstream COB (chip on board) packaging technology. In the optical and electrical chip bonding (bonding) stage, silver glue is used to precisely fix the optical chip and electrical chip on the printed circuit board. , this process is the component bonding (die bonding); then use the wire bonding machine to perform wire bonding (wire bonding) to complete the electrical connection inside the optical module. In the optical path coupling stage, an 8-way array lens group is used to complete the 90° bending and focusing of the optical path, and the active coupling process is used for the final confirmation of the optical path. The design scheme has a simple and efficient process and can achieve mass production of 100G SR4 optical modules with the help of a fully automatic placement machine, wire bonding machine, and coupling table.
100G Optical Module Market Prospects
In recent years, with the rapid development of e-commerce, high-definition transmission, cloud computing and other services, people’s demand for data transmission bandwidth is getting higher and higher. Nowadays, ports with a transmission rate of 100 Gbps have been widely used in data center switching equipment to realize centralized processing, analysis and storage of data services. The downlink ports in the data center and access network are very urgent for short-distance transmission. 100G SR4 parallel optical transceiver module, as the main optical module product used in high-speed and large-capacity communication systems, has the advantages of high transmission rate, mature technology and low cost. , will have huge market prospects.
How 100G SR4 Optical Module Works
According to the 100G SR4 optical module protocol requirements, the optical module contains 4 channels of transmitting and receiving, which can realize the electro-optical and photoelectric conversion of 4 channels of 25 Gbps signals. At the transmitting end, four 25 Gbps electrical signals enter the vertical-cavity surface-emitting laser (VCSEL) driver chip of the 100G optical module through the golden finger, and the VCSEL driver chip outputs bias current and modulated current to drive the VCSEL array to emit light. Electro-optical conversion. At the receiving end, the 4-way 25 Gbps optical signals are coupled to the photodiode (PD) array through the optical fiber array, and the 4-way optical signals are converted into 4-way current signals, and the 4-way current signals pass through the transimpedance limit. Amplifier (TIA/LA) chip converts into 4 channels of 25 Gbps voltage signal to complete photoelectric conversion.
IIC communication is used between the control chip (MCU), the VCSEL driver chip, and the trans-impedance amplifier chip (TIA/LA). Its main tasks include: Initializing the VCSEL driver chip and the trans-impedance amplifier chip; embedding the SFF8636 standard protocol; Sampling completes the real-time monitoring of the internal working voltage, temperature, bias current, transmitted optical power, and received optical power of the module; IIC data communication with external switches is carried out according to the protocol.
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